Chipmaker Qualcomm used the Samsung Galaxy Z Flip 3 5G as a prototype to demonstrate the iSIM technology jointly developed with Vodafone and Thales. The feature of this technology is that the SIM card is integrated into the main processor of the mobile device, combined with the iSIM and the operator’s remote management platform so that users can obtain mobile network services without using a physical SIM card or a dedicated chip.
According to Qualcomm, iSIM is integrated into the processor itself, so there’s no need for an extra SIM card slot or the eSIM, which is integrated into the phone’s motherboard, allowing for greater system integration, higher performance, and increased memory capacity. After the iSIM technology is integrated into the processor, notebooks, tablet computers, virtual reality platforms, Internet of Things, and wearable devices will be supported by mobile network services in the future.
In the statement Enrico Salvatori, Senior Vice President and President, Europe/MEA, Qualcomm Europe said “Some of the areas that will benefit most from iSIM technology include smartphones, mobile PCs, VR/XR headsets, and industrial IoT. By engineering the iSIM technology into the SoC, we are able to create additional support for OEMs in our Snapdragon platform,”
“The iSIM, combined with our remote management platform, is a major step in this direction, allowing devices to be connected without a physical SIM or dedicated chip, making connectivity to many objects – the promise of the connected IoT world – a reality,” Alex Froment-Curtil, Chief Commercial Officer, Vodafone added.
In addition, iSIM technology can simplify and enhance device design and performance by freeing up space previously occupied in devices, allowing devices that previously had no built-in SIM card to enable mobile network connectivity. At the same time, the technology also allows operators to utilize existing eSIM infrastructure for remote SIM provisioning.